ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for input decoupling. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, output voltage, and enable pin voltage using an oscilloscope. Ensure that the input voltage is within the recommended range, the enable pin is properly biased, and the output voltage is within the specified range. Also, check for any short circuits or open circuits on the PCB.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for output decoupling. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ensure stable operation.
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