ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 125°C.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for input decoupling. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
To troubleshoot issues with output voltage regulation, check the input voltage, output load, and feedback resistors for correct values and connections. Ensure that the output capacitor is of sufficient value and type, and that the device is not overheating. If issues persist, consult the datasheet's application notes and ROHM's technical support resources.
ROHM recommends using a low-ESR ceramic capacitor with a value of 22uF to 47uF for output filtering. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ensure stable operation.
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