BA891,115 - NXP

BA891,115 Details

• Manufacturer Part Number:

  BA891,115

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOD

• Package Description:

  ULTRA SMALL, PLASTIC, SMD, UFP, SC-79, 2 PIN

• Pin Count:

  2

• Manufacturer Package Code:

  SOD523

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8541.10.00

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Configuration:

  SINGLE

• Diode Capacitance-Max:

  1.05 pF

• Diode Element Material:

  SILICON

• Diode Type:

  MIXER DIODE

• Forward Voltage-Max (VF):

  1 V

• Frequency Band:

  VERY HIGH FREQUENCY

• JESD-30 Code:

  R-PDSO-F2

• JESD-609 Code:

  e3

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  2

• Operating Temperature-Max:

  150 °C

• Operating Temperature-Min:

  -65 °C

• Output Current-Max:

  0.1 A

• Package Body Material:

  PLASTIC/EPOXY

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Power Dissipation-Max:

  0.715 W

• Qualification Status:

  Not Qualified

• Rep Pk Reverse Voltage-Max:

  35 V

• Surface Mount:

  YES

• Technology:

  PLANAR DOPED BARRIER

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  FLAT

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30