BAP55LX,315 - NXP

BAP55LX,315 Details

• Manufacturer Part Number:

  BAP55LX,315

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Part Package Code:

  DFN

• Package Description:

  1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2

• Pin Count:

  2

• Manufacturer Package Code:

  SOD882D

• ECCN Code:

  EAR99

• HTS Code:

  8541.10.00

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Application:

  ATTENUATOR; SWITCHING

• Breakdown Voltage-Min:

  50 V

• Configuration:

  SINGLE

• Diode Capacitance-Max:

  0.28 pF

• Diode Capacitance-Nom:

  0.28 pF

• Diode Element Material:

  SILICON

• Diode Forward Resistance-Max:

  4.5 Ω

• Diode Res Test Current:

  0.5 mA

• Diode Res Test Frequency:

  100 MHz

• Diode Type:

  PIN DIODE

• Frequency Band:

  S BAND

• JESD-30 Code:

  R-PDSO-N2

• JESD-609 Code:

  e3

• Minority Carrier Lifetime-Nom:

  0.27 µs

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  2

• Operating Temperature-Max:

  150 °C

• Operating Temperature-Min:

  -65 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Power Dissipation-Max:

  0.135 W

• Qualification Status:

  Not Qualified

• Reverse Test Voltage:

  20 V

• Surface Mount:

  YES

• Technology:

  POSITIVE-INTRINSIC-NEGATIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30