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BAP64-03,115 - NXP

Description: PIN Diodes PIN 175V 100MA

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BAP64-03,115 Details

  • Manufacturer Part Number:

    BAP64-03,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SMD, SC-76, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH VOLTAGE

  • Application:

    ATTENUATOR; SWITCHING

  • Breakdown Voltage-Min:

    175 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.35 pF

  • Diode Capacitance-Nom:

    0.52 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    1.35 Ω

  • Diode Res Test Current:

    0.5 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    S BAND

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    1.55 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAP64-03,115 Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. Ensure that the input and output tracks are separated and shielded to minimize electromagnetic interference (EMI).
  • Implement a robust thermal management system, such as a heat sink or thermal interface material, to maintain a junction temperature below 150°C. Ensure proper airflow and avoid thermal hotspots.
  • Handle the device with an anti-static wrist strap or mat. Store the device in an anti-static bag or container, and avoid touching the pins or leads. Follow standard ESD handling procedures.
  • Yes, the BAP64-03,115 is suitable for switching power supply applications. However, ensure that the device is properly biased and that the output is filtered to minimize electromagnetic interference (EMI).
  • Check the PCB layout, component values, and biasing conditions. Verify that the device is properly decoupled and that the input and output tracks are properly terminated. Consult the datasheet and application notes for guidance.

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BAP64-03,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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