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BAP65-02,115 - NXP

Description: NXP BAP65-02,115 PIN Diode, 100mA, 30V, 2-Pin I-IGIA

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BAP65-02,115 - NXP PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - C0603C223K8RACTU
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BAP65-02,115 Details

  • Manufacturer Part Number:

    BAP65-02,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOD

  • Package Description:

    ULTRA SMALL, PLASTIC, SC-79, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH VOLTAGE

  • Application:

    ATTENUATOR; SWITCHING

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.9 pF

  • Diode Capacitance-Nom:

    0.65 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.9 Ω

  • Diode Res Test Current:

    5 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    0.17 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.715 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAP65-02,115 Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. Ensure that the input and output tracks are separated and shielded to minimize electromagnetic interference (EMI).
  • Implement a robust thermal management system, such as a heat sink or thermal pad, to maintain a junction temperature below 150°C. Ensure proper airflow and avoid overheating the device.
  • Handle the device with an anti-static wrist strap or mat. Store the device in an anti-static bag or container, and avoid touching the pins or leads.
  • Yes, the BAP65-02,115 is suitable for switching power supply applications due to its high switching frequency and low power losses. However, ensure proper design and layout to minimize electromagnetic interference (EMI).
  • Use a thermal imaging camera to identify hotspots. Check the PCB layout and component placement for any errors or omissions. Verify the input voltage, current, and frequency to ensure they are within the recommended specifications.

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BAP65-02,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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