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BAP65-02,135 - NXP

Description: RF Diode PIN - Single 30V 100 mA 715 mW SOD-523

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BAP65-02,135 Details

  • Manufacturer Part Number:

    BAP65-02,135

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOD

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.9 pF

  • Diode Capacitance-Nom:

    0.65 pF

  • Diode Forward Resistance-Max:

    0.9 Ω

  • Diode Res Test Current:

    5 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    0.17 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    30

BAP65-02,135 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the input voltage, and a capacitance value between 1uF to 10uF. NXP recommends using a low-ESR capacitor, such as an X7R or X5R type, to minimize voltage ripple and ensure stable operation.
  • The BAP65-02,135 has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure proper thermal management, such as using a heat sink or thermal pad, to prevent overheating and ensure reliable operation.
  • Yes, the BAP65-02,135 is qualified for automotive and high-reliability applications. It meets the requirements of the Automotive Electronics Council (AEC) and is compliant with the ISO/TS 16949 standard. However, it's essential to follow NXP's guidelines for design, manufacturing, and testing to ensure the device meets the specific requirements of the application.
  • NXP provides a troubleshooting guide in the application note AN11160, which covers common issues and their possible causes. It's essential to follow a systematic approach to identify and resolve the issue, including checking the input voltage, output load, and PCB layout, as well as verifying the component values and soldering quality.

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BAP65-02,135 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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