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BAP65-03,115 - NXP

Description: NXP BAP65-03,115 PIN Diode, 100mA, 30V, 2-Pin UMD

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PCB Footprints
BAP65-03,115 - NXP PCB footprint - Diodes Moulded - Diodes Moulded - Package outline SOD323
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BAP65-03,115 - NXP  - 3D model - Diodes Moulded - Package outline SOD323
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BAP65-03,115 Details

  • Manufacturer Part Number:

    BAP65-03,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-76, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Application:

    ATTENUATOR; SWITCHING

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.9 pF

  • Diode Capacitance-Nom:

    0.65 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.9 Ω

  • Diode Res Test Current:

    5 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    0.17 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAP65-03,115 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal via array under the package are recommended for optimal thermal performance.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10°C/W.
  • The maximum allowed voltage on the input pins is 6.5V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the input voltage below 5.5V.
  • The BAP65-03,115 has internal ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • The recommended storage temperature range for the BAP65-03,115 is -40°C to 125°C. Storage outside this range may affect the device's reliability and performance.

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BAP65-03,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image 934056547115 NXP Semiconductors

Pin Diode, 30V V(BR), Silicon