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BAP70-03 - NXP

Description: NXP Semiconductors BAP70-03/SOD2///REEL 7 Q1/T1 *STANDARD MARK SMD

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Symbol
BAP70-03 - NXP - PCB symbol
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PCB Footprints
BAP70-03 - NXP PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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3D Models
BAP70-03 - NXP - 3D model - Small Outline Diode - SOD323
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BAP70-03 Details

  • Manufacturer Part Number:

    BAP70-03

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-76

  • Package Description:

    PLASTIC, SC-76, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH VOLTAGE

  • Application:

    ATTENUATOR

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.25 pF

  • Diode Capacitance-Nom:

    0.57 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    1.9 Ω

  • Diode Res Test Current:

    0.5 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    1.25 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAP70-03 Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow NXP's recommended operating conditions, including derating the device's power dissipation according to the ambient temperature. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The BAP70-03 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV HBM (Human Body Model) and 200V MM (Machine Model) ESD protection is recommended for the device.
  • Yes, the BAP70-03 can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended switching frequency range (up to 100 kHz) and that the output voltage is properly filtered to minimize ringing and overshoot.
  • When selecting external components, consider the device's operating frequency, output voltage, and current requirements. NXP provides a recommended component list in the datasheet, but it's essential to verify the component's specifications and ensure they meet the application's requirements.

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BAP70-03 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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