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BAR6304WH6327XTSA1 - Infineon

Description: PIN Diodes RF DIODE

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BAR6304WH6327XTSA1 Details

  • Manufacturer Part Number:

    BAR6304WH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Application:

    SWITCHING

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.3 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    2 Ω

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    S BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Minority Carrier Lifetime-Nom:

    0.075 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.25 W

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAR6304WH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the derating guidelines in the datasheet, ensuring proper thermal management, and using a thermally conductive material (e.g., thermal tape or thermal grease) between the device and heat sink.
  • Infineon recommends a peak reflow temperature of 260°C, with a soldering time of 30-60 seconds. The device is also compatible with lead-free soldering processes.
  • Infineon recommends storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Devices should be handled with anti-static precautions to prevent ESD damage.
  • Infineon recommends using a curve tracer or a semiconductor parameter analyzer to characterize the device's electrical characteristics. A thermal chamber can be used to test the device's performance under various temperature conditions.

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BAR6304WH6327XTSA1 Overview

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