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BAS316_R1_00001 - PANJIT

Description: Diodes - General Purpose, Power, Switching /A16/TR/7"/HF/5K/SOD-323/SWI/SOD/USM-04A/USM04-QI35/PJ///

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PCB Footprints
BAS316_R1_00001 - PANJIT PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-323
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3D Models
BAS316_R1_00001 - PANJIT  - 3D model - Small Outline Diode Flat Lead - SOD-323
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BAS316_R1_00001 Details

  • Manufacturer Part Number:

    BAS316_R1_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.4 W

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

BAS316_R1_00001 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BAS316_R1_00001 is -40°C to 125°C, although it can withstand storage temperatures from -55°C to 150°C.
  • To ensure reliability in high-humidity environments, it's recommended to follow proper handling and storage procedures, such as storing the devices in a dry, nitrogen-filled environment, and using moisture-sensitive packaging. Additionally, consider using conformal coating or potting to protect the device from moisture.
  • The maximum allowable power dissipation for the BAS316_R1_00001 is typically around 500 mW, but this can vary depending on the specific application and operating conditions. It's essential to ensure that the device is properly heat-sinked and that the thermal resistance is within acceptable limits.
  • Yes, the BAS316_R1_00001 can be used in switching applications, but it's essential to ensure that the device is properly biased and that the switching frequency is within the recommended range. Additionally, consider using a suitable gate driver and ensuring that the device is properly heat-sinked to prevent overheating.
  • To troubleshoot issues with the BAS316_R1_00001, start by verifying the device's pinout and ensuring that it's properly connected to the circuit. Check for signs of physical damage, such as cracks or burn marks, and verify that the device is operating within the recommended voltage and current ranges. Use oscilloscopes and other diagnostic tools to identify any anomalies in the signal waveform or voltage levels.

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BAS316_R1_00001 Overview

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