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BAS4004E6327HTSA1 - Infineon

Description: Infineon 40V 120mA, Dual Schottky Diode, 3-Pin SOT-23 BAS4004E6327HTSA1

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BAS4004E6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BAS4004E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23 1
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BAS4004E6327HTSA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT23 1
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BAS4004E6327HTSA1 Details

  • Manufacturer Part Number:

    BAS4004E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.2 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

BAS4004E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, and consider using a heat sink or thermal interface material if necessary.
  • The BAS4004E6327HTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the BAS4004E6327HTSA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and guidelines for these applications.
  • Consult the Infineon application notes and technical documentation for troubleshooting guidelines. Perform a thorough analysis of the device's operating conditions, PCB layout, and surrounding circuitry to identify potential causes of the issue.

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BAS4004E6327HTSA1 Overview

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