The recommended PCB footprint for BAS40DW-05-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a 0.5mm diameter hole in the center for the drain pin.
To ensure reliable wire bonding, use a wire bondable gold wire with a diameter of 0.7mil to 1.0mil, and follow the recommended wire bonding parameters: 150°C to 180°C bonding temperature, 50gf to 100gf bonding force, and 10ms to 20ms bonding time.
The maximum allowable power dissipation for BAS40DW-05-TP is 1.5W at an ambient temperature of 25°C, with a maximum junction temperature of 150°C.
To handle ESD protection for BAS40DW-05-TP, use a human body model (HBM) ESD protection circuit with a minimum of 2kV rating, and follow proper handling and storage procedures to prevent ESD damage.
The recommended storage condition for BAS40DW-05-TP is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity of 60% or less, in its original packaging or a shielded bag to prevent ESD damage.
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BAS40DW-05-TP Overview
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