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BAS40DW-06-TP - MCC

Description: Diode Array 2 Pair Common Anode 40 V 200mA Surface Mount 6-TSSOP, SC-88, SOT-363

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PCB Footprints
BAS40DW-06-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363 (Thicknes 1.2mm)
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3D Models
BAS40DW-06-TP - MCC  - 3D model - SOT23 (6-Pin) - SOT-363 (Thicknes 1.2mm)
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BAS40DW-06-TP Details

  • Manufacturer Part Number:

    BAS40DW-06-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, PLASTIC PACKAGE-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    2 BANKS, COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Recovery Time-Max:

    0.005 µs

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

BAS40DW-06-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAS40DW-06-TP is a rectangular pad with dimensions of 1.3mm x 0.8mm, with a 0.5mm x 0.5mm thermal pad in the center.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum allowable voltage for BAS40DW-06-TP is 40V, as specified in the datasheet. Exceeding this voltage can damage the device.
  • BAS40DW-06-TP is rated for operation up to 150°C. However, it's recommended to derate the device's power handling capability at higher temperatures to ensure reliable operation.
  • BAS40DW-06-TP has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.

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BAS40DW-06-TP Overview

Use the download button to access the BAS40DW-06-TP schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for BAS40DW-06-TP, check out Findchips.com