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BAS7002LE6327XTMA1 - Infineon

Description: Rectifier Diode Schottky Si 0.07A Automotive AEC-Q101 2-Pin TSLP T/R

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PCB Footprints
BAS7002LE6327XTMA1 - Infineon PCB footprint - Other - Other - PG-TSLP-2-1
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BAS7002LE6327XTMA1 - Infineon  - 3D model - Other - PG-TSLP-2-1
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BAS7002LE6327XTMA1 Details

  • Manufacturer Part Number:

    BAS7002LE6327XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSLP-2-1, 2 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.07 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

BAS7002LE6327XTMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating temperature range (TJ) of -40°C to 150°C.
  • The BAS7002LE6327XTMA1 has integrated ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling to prevent damage.
  • Yes, the BAS7002LE6327XTMA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure compliance with specific industry standards and regulations.
  • Consult the datasheet and application notes for troubleshooting guidelines. If issues persist, contact Infineon's technical support or a local distributor for assistance.

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BAS7002LE6327XTMA1 Overview

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