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BAT1502LRHE6327XTSA1 - Infineon

Description: INFINEON - BAT1502LRHE6327XTSA1 - RF Schottky Diode, Single, 4 V, 110 mA, 410 mV, 0.2 pF, TSLP-2-7

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BAT1502LRHE6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BAT1502LRHE6327XTSA1 - Infineon PCB footprint - Other - Other - BAT1502LRHE6327XTSA1-1
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BAT1502LRHE6327XTSA1 - Infineon - 3D model - Other - BAT1502LRHE6327XTSA1-1
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BAT1502LRHE6327XTSA1 Details

  • Manufacturer Part Number:

    BAT1502LRHE6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Additional Feature:

    LOW NOISE

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.35 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Frequency Band:

    X BAND

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Power Dissipation-Max:

    0.1 W

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Type of Schottky Barrier:

    LOW BARRIER

BAT1502LRHE6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends derating the device's power dissipation according to the temperature derating curve in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
  • The BAT1502LRHE6327XTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. A minimum of 1kV HBM and 250V MM ESD protection is recommended.
  • Yes, the BAT1502LRHE6327XTSA1 is qualified according to AEC-Q101, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required depending on the specific application.
  • Infineon recommends soldering the device using a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Hand soldering is not recommended due to the device's small size and thermal sensitivity.

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BAT1502LRHE6327XTSA1 Overview

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