BAT2402LSE6327XTSA1 footprint, schematic symbol and 3D model by Infineon

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PCB Footprints

BAT2402LSE6327XTSA1 - Infineon PCB footprint - Other - Other - TSSLP-2-1

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Datasheet Download Datasheet
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Part Number BAT2402LSE6327XTSA1
Manufacturer Infineon
Pin Count 2
Part Category Schottky Diode
Package Category Other
Footprint Name Other - TSSLP-2-1
Released Date Jul 22, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

BAT2402LSE6327XTSA1 Details

Manufacturer Part Number:
BAT2402LSE6327XTSA1
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Austria, Malaysia
ECCN Code:
EAR99
HTS Code:
8541.10.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
3
Breakdown Voltage-Min:
4 V
Configuration:
SINGLE
Diode Capacitance-Max:
0.23 pF
Diode Element Material:
SILICON
Diode Type:
MIXER DIODE
Forward Voltage-Max (VF):
0.41 V
Frequency Band:
K BAND
JESD-30 Code:
R-PBCC-N2
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Output Current-Max:
0.11 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Power Dissipation-Max:
0.1 W
Reverse Current-Max:
5 µA
Reverse Test Voltage:
1 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Gold (Au)
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Type of Schottky Barrier:
LOW BARRIER

BAT2402LSE6327XTSA1 Frequently Asked Questions (FAQs)

Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends derating the device's power dissipation according to the temperature derating curve in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a total process time of 3-5 minutes.
Infineon recommends storing the devices in a dry, nitrogen-filled package or a moisture barrier bag. If the device is exposed to moisture, bake it at 125°C for 24 hours to remove moisture before soldering.
Infineon recommends handling the devices with ESD-protective equipment, storing them in ESD-protective packaging, and grounding personnel before handling the devices.

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