Part Image

BAT6804WH6327XTSA1 - Infineon

Description: RF Diode Schottky - 1 Pair Series Connection 8V 130 mA 150 mW PG-SOT323

Download BAT6804WH6327XTSA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BAT6804WH6327XTSA1 - Infineon PCB footprint - Other - Other - BAT6804WH6327XTSA1-4
click to zoom
3D Models
BAT6804WH6327XTSA1 - Infineon  - 3D model - Other - BAT6804WH6327XTSA1-4
click to zoom

BAT6804WH6327XTSA1 Details

  • Manufacturer Part Number:

    BAT6804WH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    1 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Frequency Band:

    VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.15 W

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAT6804WH6327XTSA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Also, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Avoid using soldering temperatures above 280°C (536°F) to prevent damage to the device.
  • Yes, the BAT6804WH6327XTSA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Use a systematic approach to troubleshoot the issue. Check the device's operating conditions, PCB layout, and thermal management. Use tools like thermal imaging cameras or oscilloscopes to identify the root cause of the issue.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BAT6804WH6327XTSA1 Overview

Use the download button to access the BAT6804WH6327XTSA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BAT68, or try a keyword search, such as Microwave Mixer Diodes

Parts related to BAT6804WH6327XTSA1

Showing 0 results