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BAT854AW - Nexperia

Description: Diode, NXP, BAT854AW, PK

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PCB Footprints
BAT854AW - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323_2021
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3D Models
BAT854AW - Nexperia  - 3D model - SOT23 (3-Pin) - SOT-323_2021
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BAT854AW Details

  • Manufacturer Part Number:

    BAT854AW

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAT854AW Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended. The thermal pad should be connected to a ground plane or a heat sink to dissipate heat efficiently.
  • To ensure reliability in high-temperature applications, it is essential to follow Nexperia's recommended derating guidelines for the BAT854AW. The device should be operated within the recommended temperature range, and the power dissipation should be limited to avoid overheating. Additionally, a thermal management system, such as a heat sink or thermal interface material, can be used to reduce the junction temperature.
  • Yes, the BAT854AW can be used in switching applications, but it is essential to consider the device's switching characteristics, such as the turn-on and turn-off times, to ensure reliable operation. The device should be operated within the recommended switching frequency range, and the voltage and current ratings should not be exceeded.
  • To protect the BAT854AW from ESD, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. The device should be handled by the body only, and not by the leads, to prevent ESD damage.
  • Nexperia recommends storing the BAT854AW in a dry, cool place, away from direct sunlight and moisture. The devices should be stored in their original packaging or in a similar anti-static packaging to prevent ESD damage. The storage temperature range should be between -40°C and 125°C.

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BAT854AW Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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