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BAV170E6327HTSA1 - Infineon

Description: Diode Array 1 Pair Common Cathode 80 V 200mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3

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BAV170E6327HTSA1 - Infineon PCB footprint - Other - Other - PG-SOT23-3-1
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BAV170E6327HTSA1 - Infineon  - 3D model - Other - PG-SOT23-3-1
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BAV170E6327HTSA1 Details

  • Manufacturer Part Number:

    BAV170E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    TR, 7 INCH: 3000

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    85 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    85 V

  • Reverse Current-Max:

    0.005 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Reverse Test Voltage:

    75 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAV170E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The BAV170E6327HTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of 1kV HBM and 100V MM protection is recommended.
  • Yes, the BAV170E6327HTSA1 is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required to meet specific industry standards.
  • Infineon recommends a peak reflow temperature of 260°C, with a maximum of 3 reflow cycles. The device is also compatible with lead-free soldering processes.

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BAV170E6327HTSA1 Overview

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