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BAV70 - Multicomp Pro

Description: DIODE, DUAL SWITCHING, SOT-23

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BAV70 - Multicomp Pro PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BAV70
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BAV70 - Multicomp Pro  - 3D model - SOT23 (3-Pin) - BAV70
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BAV70 Details

  • Manufacturer Part Number:

    BAV70

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    6.1

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.225 W

  • Rep Pk Reverse Voltage-Max:

    75 V

  • Reverse Recovery Time-Max:

    0.006 µs

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

BAV70 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BAV70 is -65°C to 150°C, although it can withstand storage temperatures up to 200°C.
  • The BAV70 is an ESD-sensitive device, so it's essential to handle it with care. Use anti-static wrist straps, mats, and packaging to prevent damage from electrostatic discharge.
  • The maximum allowable voltage for the BAV70 is 70V, as indicated in the part number. Exceeding this voltage can lead to device failure or reduced lifespan.
  • Yes, the BAV70 is suitable for high-frequency applications up to several hundred MHz due to its low capacitance and fast switching times. However, it's essential to consider the device's parasitic capacitance and inductance when designing high-frequency circuits.
  • To ensure reliability, follow proper PCB design and layout guidelines, use adequate heat sinking, and avoid exceeding the device's maximum ratings. Additionally, consider using derating guidelines to reduce stress on the device and increase its lifespan.

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BAV70 Overview

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Part Image BAV70 STMicroelectronics

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