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BAV70E6327HTSA1 - Infineon

Description: Diodes - General Purpose, Power, Switching AF DIODE 85V 0.2A

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BAV70E6327HTSA1 Details

  • Manufacturer Part Number:

    BAV70E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    85 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.15 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

BAV70E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the thermal pad to ensure good heat dissipation. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane on the PCB.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rated value.
  • The BAV70E6327HTSA1 has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions during assembly and handling. The device can withstand ESD pulses up to 2kV according to the Human Body Model (HBM) and 150V according to the Machine Model (MM).
  • Yes, the BAV70E6327HTSA1 is qualified according to AEC-Q101, making it suitable for automotive and high-reliability applications. However, it is recommended to consult with Infineon's technical support to ensure that the device meets the specific requirements of your application.
  • The recommended soldering conditions for the BAV70E6327HTSA1 are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It is recommended to follow the soldering profile provided in the datasheet to ensure reliable assembly.

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BAV70E6327HTSA1 Overview

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