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BAV99SH6327XTSA1 - Infineon

Description: Diodes - General Purpose, Power, Switching AF DIGITAL TRANSISTOR

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BAV99SH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BAV99SH6327XTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363 1
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3D Models
BAV99SH6327XTSA1 - Infineon - 3D model - SOT23 (6-Pin) - SOT363 1
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BAV99SH6327XTSA1 Details

  • Manufacturer Part Number:

    BAV99SH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOT-363, 6 PIN

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    85 V

  • Configuration:

    2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4.5 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.33 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    85 V

  • Reverse Current-Max:

    0.15 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAV99SH6327XTSA1 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BAV99SH6327XTSA1 is -40°C to 125°C.
  • To ensure reliability, follow the recommended thermal design and layout guidelines, and consider using thermal interface materials to reduce thermal resistance. Additionally, ensure proper cooling mechanisms are in place to maintain a safe operating temperature.
  • Key considerations include minimizing parasitic inductance, using a solid ground plane, and ensuring proper decoupling and bypassing. Follow Infineon's recommended PCB layout guidelines and consult the datasheet for specific recommendations.
  • Follow Infineon's EMI and EMC guidelines, and consider using shielding, filtering, and grounding techniques to minimize EMI and ensure EMC compliance.
  • The power dissipation of the BAV99SH6327XTSA1 must be considered in the overall system design to ensure proper thermal management and to prevent overheating. This may involve selecting suitable heat sinks, thermal interfaces, and cooling mechanisms.

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BAV99SH6327XTSA1 Overview

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