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BAW56-7-F - Diodes Incorporated

Description: Diodes Inc BAW56-7-F, Dual SMT Switching Diode, Common Anode, 75V 300mA, 4ns, 3-Pin SOT-23

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BAW56-7-F - Diodes Incorporated - PCB symbol
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PCB Footprints
BAW56-7-F - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BAW56-7-F
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3D Models
BAW56-7-F - Diodes Incorporated - 3D model - SOT23 (3-Pin) - BAW56-7-F
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BAW56-7-F Details

  • Manufacturer Part Number:

    BAW56-7-F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    75 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56-7-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAW56-7-F is a standard SOT23 package footprint with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable soldering of BAW56-7-F, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid overheating the component and use a soldering technique that minimizes thermal stress.
  • The maximum operating temperature range for BAW56-7-F is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, BAW56-7-F is suitable for high-frequency applications up to 1 GHz, but it's essential to consider the component's parasitic inductance and capacitance, as well as the PCB layout and design, to minimize signal degradation and ensure optimal performance.
  • To handle ESD protection for BAW56-7-F, follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the components in an ESD-protected environment. The device itself has a human body model (HBM) ESD rating of 2 kV.

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BAW56-7-F Overview

Use the download button to access the BAW56-7-F schematic symbol, PCB footprint, and 3D model.
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