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BAW56LT1 - onsemi

Description: Obsolete - 70 V Dual Common Anode Switching Diode

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PCB Footprints
BAW56LT1 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318 ISSUE AT_2023
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3D Models
BAW56LT1 - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318 ISSUE AT_2023
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BAW56LT1 Details

  • Manufacturer Part Number:

    BAW56LT1

  • Brand Name:

    onsemi

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    CASE 318-08, TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e0

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    30 µA

  • Reverse Recovery Time-Max:

    0.006 µs

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56LT1 Frequently Asked Questions (FAQs)

  • A good PCB layout for BAW56LT1 involves keeping the leads as short as possible, using a ground plane, and minimizing the distance between the device and the antenna. A 4-layer PCB with a dedicated ground layer is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermally conductive PCB material and a heat sink if necessary.
  • Although the datasheet specifies a maximum voltage rating of 70V, it's recommended to derate the voltage to 60V or lower to ensure long-term reliability and to account for any voltage spikes or transients.
  • While the BAW56LT1 is primarily designed for linear applications, it can be used in switching applications with caution. However, the device may not be optimized for high-frequency switching, and the switching frequency should be limited to minimize power losses and ensure reliability.
  • To troubleshoot issues with the BAW56LT1, start by verifying the PCB layout and ensuring that the device is properly soldered. Check for any signs of physical damage or contamination. Use a thermal camera or thermometer to identify hotspots, and measure the current draw and voltage across the device to identify any anomalies.

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BAW56LT1 Overview

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Part Image BAW56 Microsemi Corporation (now Microchip)

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Part Image BAW56-7 Diodes Incorporated

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Part Image BAW56S62Z Fairchild Semiconductor Corporation

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For a full list of alternate parts for BAW56LT1, check out Findchips.com