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BAW56LT1G - onsemi

Description: S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
BAW56LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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3D Models
BAW56LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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BAW56LT1G Details

  • Manufacturer Part Number:

    BAW56LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Recovery Time-Max:

    0.006 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for BAW56LT1G involves keeping the leads as short as possible, using a ground plane, and minimizing the distance between the device and the antenna. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • To prevent ESD damage, it's recommended to use a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Additionally, handling the device by the body or using an anti-static wrist strap can help prevent ESD damage.
  • While BAW56LT1G is primarily designed for linear applications, it can be used in switching applications with some precautions. However, the device may not be optimized for switching frequencies above 100 kHz, and the user should carefully evaluate the device's performance and thermal management in such applications.
  • To troubleshoot issues with BAW56LT1G, start by verifying the device's pinout and orientation, checking for proper power supply and biasing, and ensuring that the device is operated within its recommended operating conditions. Use a scope or signal analyzer to check the device's output and input signals.

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BAW56LT1G Overview

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