Part Image

BAW56M3T5G - onsemi

Description: 2 diodes in 1 package; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Download BAW56M3T5G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BAW56M3T5G - onsemi PCB footprint - Other - Other - SOT−723  CASE 631AA−01 ISSUE D
click to zoom
3D Models
BAW56M3T5G - onsemi  - 3D model - Other - SOT−723  CASE 631AA−01 ISSUE D
click to zoom

BAW56M3T5G Details

  • Manufacturer Part Number:

    BAW56M3T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-723 3 LEAD

  • Package Description:

    SOT-723, CASE 631AA-01, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    631AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    75 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.265 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    75 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Recovery Time-Max:

    0.006 µs

  • Reverse Test Voltage:

    75 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56M3T5G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAW56M3T5G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm diameter hole in the center for the device's anode lead.
  • To ensure reliable wire bonding, use a gold wire with a diameter of 0.025 mm to 0.05 mm, and bond to the device's pads using a wedge or ball-wedge bonding process. Apply a bonding force of 10-20 grams and a bonding temperature of 150-200°C.
  • The maximum allowable voltage stress on the BAW56M3T5G is 1.5 times the rated voltage, which is 150 V for this device. Exceeding this voltage may cause permanent damage to the device.
  • To prevent electrostatic discharge (ESD) damage, handle the BAW56M3T5G with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in a conductive bag or wrapped in conductive foam when not in use.
  • Store the BAW56M3T5G in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BAW56M3T5G Overview

Use the download button to access the BAW56M3T5G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BAW56, or try a keyword search, such as Rectifier Diodes

Parts related to BAW56M3T5G

Showing 0 results