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BAW78DH6327XTSA1 - Infineon

Description: Diodes - General Purpose, Power, Switching AF DIODES

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BAW78DH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BAW78DH6327XTSA1 - Infineon PCB footprint - Other - Other - SOT89_ffw
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3D Models
BAW78DH6327XTSA1 - Infineon - 3D model - Other - SOT89_ffw
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BAW78DH6327XTSA1 Details

  • Manufacturer Part Number:

    BAW78DH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOT-89, 3 PIN

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    400 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JESD-30 Code:

    R-PSSO-F3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    1 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

BAW78DH6327XTSA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and follow proper handling and storage procedures to prevent ESD damage.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid using wave soldering or hand soldering, as it may damage the device.

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BAW78DH6327XTSA1 Overview

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