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BB135,115 - NXP

Description: NXP BB135,115 Varactor, 17.5pF min, 8.9:1 Tuning Ratio, 30V, 2-Pin SOD-323

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BB135,115 - NXP - PCB symbol
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PCB Footprints
BB135,115 - NXP PCB footprint - Small Outline Diode - Small Outline Diode - BB135,115
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3D Models
BB135,115 - NXP - 3D model - Small Outline Diode - BB135,115
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BB135,115 Details

  • Manufacturer Part Number:

    BB135,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SMD, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Capacitance Ratio-Min:

    8.9

  • Diode Capacitance-Nom:

    19.25 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    VARIABLE CAPACITANCE DIODE

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Variable Capacitance Diode Classification:

    ABRUPT

BB135,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance-controlled line to the antenna.
  • Use a thermal pad or thermal via to connect the die attach pad to a heat sink or a thermal ground plane. Ensure good airflow and avoid blocking the thermal pad with components or solder resist.
  • A quarter-wave monopole or a dipole antenna with a 50-ohm impedance is recommended. The antenna should be tuned for the specific frequency band and have a good return loss (< -10 dB) to ensure optimal performance.
  • Use a low-ESR capacitor (e.g., 10 μF, 10 V, X5R) close to the device to filter the power supply. Ensure the power supply can deliver the required current (up to 400 mA) and use a voltage regulator with a low dropout voltage.
  • Use a 26 MHz crystal oscillator with a load capacitance of 10-20 pF and a series resistance of 1-2 kΩ. Ensure the oscillator is properly decoupled and shielded to minimize noise and interference.

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BB135,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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