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BCM857BS - Nexperia

Description: NEXPERIA - BCM857BS - TRANSISTOR, MATCHED, SOT-363

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Symbol
BCM857BS - Nexperia - PCB symbol
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PCB Footprints
BCM857BS - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363 (SC-88)
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3D Models
BCM857BS - Nexperia - 3D model - SOT23 (6-Pin) - SOT-363 (SC-88)
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BCM857BS Details

  • Manufacturer Part Number:

    BCM857BS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-88, SOT-363, TSSOP-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    2.2 pF

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    175 MHz

  • VCEsat-Max:

    0.4 V

BCM857BS Frequently Asked Questions (FAQs)

  • Nexperia provides a recommended PCB layout in their application note AN11173, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The BCM857BS has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, Nexperia recommends using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink or thermal ground plane.
  • The BCM857BS is rated for operation from -40°C to 125°C, but Nexperia recommends operating the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Nexperia recommends following good EMC design practices, such as using a shielded enclosure, minimizing loop areas, and using filtering and shielding components to reduce electromagnetic radiation and susceptibility.
  • Nexperia recommends following the JEDEC J-STD-020D.1 standard for soldering the BCM857BS, which includes guidelines for peak temperature, dwell time, and cooling rate to prevent damage to the device.

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BCM857BS Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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