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BCM857DS,115 - Nexperia

Description: Bipolar Transistors - BJT TRANS MATCHED PAIR TAPE-7

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Symbol
BCM857DS,115 - Nexperia - PCB symbol
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PCB Footprints
BCM857DS,115 - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - BCM857DS,115
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3D Models
BCM857DS,115 - Nexperia - 3D model - SOT23 (6-Pin) - BCM857DS,115
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BCM857DS,115 Details

  • Manufacturer Part Number:

    BCM857DS,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    SC-74, SOT-457, TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT457

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    2.2 pF

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.38 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    175 MHz

  • VCEsat-Max:

    0.4 V

BCM857DS,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2 oz copper thickness is recommended, and thermal vias can be used to improve heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • The BCM857DS,115 has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling and assembly.
  • Yes, the BCM857DS,115 is suitable for high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard, and Nexperia provides additional documentation and support for automotive applications.
  • To troubleshoot issues with the BCM857DS,115, start by reviewing the datasheet and application notes, and checking for proper PCB layout and thermal design. Use oscilloscopes and logic analyzers to debug the device, and consider using Nexperia's support resources and FAQs for additional guidance.

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BCM857DS,115 Overview

Use the download button to access the BCM857DS,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BCM85, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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