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BCP52 - onsemi

Description: Obsolete - PNP 80 V Bipolar Transistor

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PCB Footprints
BCP52 - onsemi PCB footprint - Other - Other - SOT230P700X180-4N
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BCP52 Details

  • Manufacturer Part Number:

    BCP52

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1.2 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    25

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BCP52 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the BCP52 is not explicitly stated in the datasheet. However, it's recommended to follow the guidelines provided in the onsemi application note AND8033/D, which provides SOA curves for similar devices.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet and application notes. Additionally, consider using a voltage regulator or a voltage reference to maintain a stable voltage supply.
  • For optimal thermal performance, follow the recommended PCB layout guidelines provided in the onsemi application note AND8033/D. Ensure good thermal conductivity by using a heat sink or thermal pad, and maintain a minimum clearance of 1.5 mm around the device.
  • Yes, the BCP52 can be used in switching applications. However, be aware of the device's switching characteristics, such as the transition frequency and rise/fall times, to avoid excessive power dissipation and ensure reliable operation.
  • To protect the BCP52 from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Implement ESD protection circuits, such as TVS diodes or ESD protection arrays, in your design.

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BCP52 Overview

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