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BCP55 - onsemi

Description: ONSEMI - BCP55 - Bipolar (BJT) Single Transistor, General Purpose, NPN, 60 V, 1.5 A, 1.5 W, SOT-223, Surface Mount

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PCB Footprints
BCP55 - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B
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3D Models
BCP55 - onsemi  - 3D model - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B
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BCP55 Details

  • Manufacturer Part Number:

    BCP55

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    25

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BCP55 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for BCP55 is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a thermally conductive material for heat dissipation.
  • Use a thermal pad or a copper pour under the device, and ensure a low thermal resistance path to the heat sink or ambient air. A minimum of 2 oz copper thickness is recommended.
  • Yes, BCP55 can be used in switching regulator applications. However, ensure that the device is properly biased and that the switching frequency is within the recommended range.
  • Use proper ESD handling and storage procedures, and consider adding ESD protection devices or circuits to the design.

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BCP55 Overview

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