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BCP5616H6327XTSA1 - Infineon

Description: For AF driver and output stages • High collector current • Low collector-emitter saturation voltage • Complementary types: BCP51...BCP53 (PNP) • Pb-free (RoHS compliant) package • Qualified according AEC Q10

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BCP5616H6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223
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BCP5616H6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - SOT223
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BCP5616H6327XTSA1 Details

  • Manufacturer Part Number:

    BCP5616H6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    TR, 7 INCH; 1000

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    80 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    2 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • VCEsat-Max:

    0.5 V

BCP5616H6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends following the guidelines in their application note AN2013-02, which provides guidance on PCB layout, component selection, and shielding to ensure EMC compliance.
  • According to Infineon's application note AN2013-03, the maximum allowed voltage transient on the input pins is 10% of the nominal input voltage, with a maximum duration of 100ms.
  • Infineon recommends using an external overvoltage protection circuit, such as a voltage supervisor or a crowbar circuit, to protect the device from overvoltage conditions.
  • Infineon recommends following the soldering profile guidelines in their application note AN2013-04, which includes temperature and time recommendations for reflow soldering.

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BCP5616H6327XTSA1 Overview

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