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BCR562E6327HTSA1 - Infineon

Description: Trans Digital BJT PNP 50V 500mA 330mW Automotive 3-Pin SOT-23 T/R

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Symbol
BCR562E6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BCR562E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23 1
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3D Models
BCR562E6327HTSA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT23 1
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BCR562E6327HTSA1 Details

  • Manufacturer Part Number:

    BCR562E6327HTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO 1

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    60

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    150 MHz

BCR562E6327HTSA1 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BCR562E6327HTSA1 is -40°C to 150°C.
  • To ensure reliability, follow the recommended thermal design and layout guidelines, and consider using thermal interface materials to reduce thermal resistance.
  • The maximum allowed voltage for the BCR562E6327HTSA1 is 650V.
  • Use a suitable heat sink, ensure good thermal contact, and follow the recommended thermal design guidelines to manage power dissipation and thermal management.
  • Yes, follow the recommended PCB layout guidelines, including keeping the component away from high-frequency signals, using a solid ground plane, and minimizing track lengths.

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BCR562E6327HTSA1 Overview

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