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BD2042AFJ-E2 - ROHM Semiconductor

Description: Power Switch ICs - Power Distribution 2Ch; Lg Current Out USB High Side Switch

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BD2042AFJ-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-J8
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BD2042AFJ-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-J8
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BD2042AFJ-E2 Details

  • Manufacturer Part Number:

    BD2042AFJ-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.5 A

  • Output Peak Current Limit-Nom:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.375 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    20 µs

  • Turn-on Time:

    6000 µs

  • Width:

    3.9 mm

BD2042AFJ-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1-10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
  • While the BD2042AFJ-E2 is rated for operation up to 125°C, ROHM recommends derating the output current and power dissipation to ensure reliable operation in high-temperature environments. Consult ROHM's application notes for specific guidance on thermal derating.
  • To troubleshoot oscillations or instability issues, check the PCB layout for parasitic inductance and capacitance, ensure proper decoupling of the input and output capacitors, and verify that the output capacitor meets the recommended specifications. Additionally, check for noise on the EN pin and ensure that it is properly filtered.

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