BD2802GU-E2 - ROHM Semiconductor

BD2802GU-E2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
• How do I ensure stable operation with a high-ESR output capacitor?
  To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
• Can I use the BD2802GU-E2 in a high-temperature environment?
  The BD2802GU-E2 is rated for operation up to 105°C, but ROHM recommends derating the output current and power dissipation to ensure reliable operation. A thermal design that keeps the junction temperature below 100°C is recommended for high-temperature applications.
• How do I calculate the power dissipation of the BD2802GU-E2?
  The power dissipation of the BD2802GU-E2 can be calculated using the formula: Pd = (VIN x IIN) + (VOUT x IOUT) + (VIN x IQ), where IQ is the quiescent current. ROHM provides a power dissipation calculation tool on their website to simplify the process.