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BD33HC5MEFJ-ME2 - ROHM Semiconductor

Description: ROHM BD33HC5MEFJ-ME2, LDO Regulator, 1.5A, 3.3 V, ±1% 8-Pin, HTSOP

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BD33HC5MEFJ-ME2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8.
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BD33HC5MEFJ-ME2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP-J8.
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BD33HC5MEFJ-ME2 Details

  • Manufacturer Part Number:

    BD33HC5MEFJ-ME2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HTSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.2 V

  • Dropout Voltage1-Nom:

    0.6 V

  • Input Voltage Absolute-Max:

    10 V

  • Input Voltage-Max:

    8 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.05%

  • Load Regulation-Max:

    0.075%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    1.5 A

  • Output Voltage1-Max:

    3.399 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3%

  • Width:

    3.9 mm

BD33HC5MEFJ-ME2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure the stability of the output voltage, it is recommended to use a capacitor with a low ESR value (less than 1 ohm) and a capacitance value of at least 10uF. Additionally, the output capacitor should be placed as close to the output pin as possible.
  • The maximum input voltage that can be applied to the device is 18V. Exceeding this voltage may cause damage to the device.
  • To protect the device from overcurrent, it is recommended to add an external current limiting resistor or a fuse in series with the input voltage. Additionally, the device has a built-in overcurrent protection circuit that will limit the output current to 1.5A.
  • The operating temperature range of the device is -40°C to 105°C. However, the device can be stored at temperatures ranging from -55°C to 150°C.

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BD33HC5MEFJ-ME2 Overview

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