ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure stable operation with a high-impedance input source, add a capacitor (e.g., 10nF to 100nF) between the input pin and the GND pin to reduce noise and oscillation. Additionally, consider adding a series resistor (e.g., 1kΩ to 10kΩ) to the input pin to limit the input current.
The maximum allowed voltage on the EN pin is VCC + 0.3V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a voltage divider to ensure the EN pin voltage remains within the specified range.
While the BD3870FS-E2 is rated for operation up to 125°C, it's essential to consider the device's power dissipation and thermal management in high-temperature environments. Ensure proper heat sinking and thermal design to prevent overheating, which can affect the device's reliability and lifespan.
To troubleshoot oscillation or instability issues, check the PCB layout for any signs of noise coupling or radiation. Ensure that the input and output pins are properly decoupled, and the device is properly grounded. Also, verify that the input voltage is within the specified range and that the device is not overheating.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
BD3870FS-E2 Overview
Use the download button to access the BD3870FS-E2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BD387,
or try a keyword search, such as Audio Control ICs
