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BD41000AFJ-CE2 - ROHM Semiconductor

Description: Interface - Specialized CXPI Transceiver SOP-J8; 7-18V; 3uA

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PCB Footprints
BD41000AFJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-J8
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3D Models
BD41000AFJ-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-J8
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BD41000AFJ-CE2 Details

  • Manufacturer Part Number:

    BD41000AFJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-10-02

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

BD41000AFJ-CE2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure the stability of the output voltage, it is recommended to use a capacitor with a low ESR value (less than 1 ohm) and a capacitance value of at least 10uF. Additionally, the output capacitor should be placed as close to the IC as possible.
  • The maximum input voltage that can be applied to the VIN pin is 18V. Exceeding this voltage may cause damage to the IC.
  • The output voltage can be adjusted by changing the resistance ratio of the feedback resistors (R1 and R2). The output voltage can be calculated using the formula: Vout = 0.8V x (1 + R2/R1).
  • The maximum output current that the BD41000AFJ-CE2 can supply is 3A. Exceeding this current may cause overheating or damage to the IC.

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