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BD4269FJ-CE2 - ROHM Semiconductor

Description: Ultra Low Quiescent Current LDO Regulator

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BD4269FJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-J8
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BD4269FJ-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-J8
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BD4269FJ-CE2 Details

  • Manufacturer Part Number:

    BD4269FJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-J8, 8-PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.03%

  • Load Regulation-Max(%):

    0.03%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR, EMBOSSED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.65 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.9 mm

BD4269FJ-CE2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure stable operation with a high-capacitance output capacitor, it is recommended to add a series resistor (Rs) and a capacitor (Cc) in parallel with the output capacitor to form a damping circuit. This helps to prevent oscillation and ensure stable operation.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may cause damage to the device.
  • The BD4269FJ-CE2 is rated for operation up to 105°C. However, it is recommended to derate the output current and voltage according to the temperature derating curve in the datasheet to ensure reliable operation.
  • The power dissipation of the device can be calculated using the formula: Pd = (Vin x Iin) + (Vout x Iout) + (Iq x Vin), where Pd is the power dissipation, Vin is the input voltage, Iin is the input current, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.

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BD4269FJ-CE2 Overview

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