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BD4269UEFJ-CE2 - ROHM Semiconductor

Description: LDO Voltage Regulators REGULATOR

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BD4269UEFJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-4
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BD4269UEFJ-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP-J8-4
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BD4269UEFJ-CE2 Details

  • Manufacturer Part Number:

    BD4269UEFJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    8 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.03%

  • Load Regulation-Max(%):

    0.03%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.9 mm

BD4269UEFJ-CE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure stable operation with a high-ESR output capacitor, add a 1-10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, consider using a low-ESR output capacitor or a capacitor with a built-in ESR reduction feature.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the maximum rating to prevent damage to the device.
  • While the BD4269UEFJ-CE2 is rated for operation up to 105°C, it's essential to consider the derating of the device's performance and reliability at high temperatures. Consult ROHM's application notes and thermal design guidelines for high-temperature applications.
  • To troubleshoot oscillations or instability issues, check the PCB layout for noise coupling, ensure proper decoupling of the input and output capacitors, and verify that the output capacitor meets the recommended specifications. Also, consider adding a small series resistor (e.g., 1-10Ω) between the output capacitor and the load to improve stability.

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BD4269UEFJ-CE2 Overview

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