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BD50GA3WEFJ-E2 - ROHM Semiconductor

Description: ROHM - BD50GA3WEFJ-E2 - Fixed LDO Voltage Regulator, 4.5V to 14V, 450mV Dropout, 5Vout, 300mAout, HTSOP-8

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BD50GA3WEFJ-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP
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3D Models
BD50GA3WEFJ-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP
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BD50GA3WEFJ-E2 Details

  • Manufacturer Part Number:

    BD50GA3WEFJ-E2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.9 V

  • Dropout Voltage1-Nom:

    0.45 V

  • Input Voltage Absolute-Max:

    15 V

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.05%

  • Load Regulation-Max(%):

    0.075%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    5.05 V

  • Output Voltage1-Min:

    4.95 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    1%

  • Width:

    3.9 mm

BD50GA3WEFJ-E2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1mm clearance around the package for airflow.
  • Implement a heat sink or thermal pad, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • Handle the device in an ESD-controlled environment, and use wrist straps or mats to prevent static damage. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.
  • Yes, the BD50GA3WEFJ-E2 is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to ensure reliability.
  • Use a logic analyzer or oscilloscope to monitor the device's input/output signals. Check the power supply voltage, input signal integrity, and output loading conditions. Consult the datasheet and application notes for troubleshooting guidelines.

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BD50GA3WEFJ-E2 Overview

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