SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Current-Max (Isup):
3 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.5 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
COMMERCIAL EXTENDED
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
5.6 mm
BD6380EFV-E2 Frequently Asked Questions (FAQs)
A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad of the IC, and to use thermal vias to dissipate heat to the top layer. Additionally, it's recommended to have a solid ground plane on the top layer to reduce thermal resistance.
To ensure stable operation with a high-ESR output capacitor, it's recommended to add a small ceramic capacitor (e.g. 1uF) in parallel with the high-ESR capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the IC. It's recommended to use a voltage divider or a level shifter if the enable signal is coming from a higher voltage domain.
The output voltage ripple can be calculated using the following formula: ΔVout = (Iout * ESR) / (f * C), where Iout is the output current, ESR is the equivalent series resistance of the output capacitor, f is the switching frequency, and C is the output capacitance.
The recommended input capacitor value is 10uF to 22uF, and the recommended type is a low-ESR ceramic capacitor (e.g. X5R or X7R). The input capacitor should be placed close to the IC to minimize parasitic inductance.
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BD6380EFV-E2 Overview
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