SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1 mm
Supply Voltage-Max (Vsup):
28 V
Supply Voltage-Min (Vsup):
19 V
Supply Voltage-Nom (Vsup):
24 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
OTHER
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
5.6 mm
BD68620EFV-E2 Frequently Asked Questions (FAQs)
ROHM provides a recommended PCB layout in the application note AN11952, which includes guidelines for component placement, thermal vias, and routing to ensure optimal performance and thermal management.
The datasheet provides a list of recommended external components, including capacitors, resistors, and inductors. Additionally, ROHM provides a component selection guide in the application note AN11953, which helps engineers choose the right components based on their specific application requirements.
The thermal derating curve is not explicitly provided in the datasheet, but ROHM provides a thermal design guide in the application note AN11954, which includes thermal impedance data and derating curves to help engineers design a thermally efficient system.
The BD68620EFV-E2 is rated for operation up to 105°C, but ROHM recommends derating the device's power dissipation at higher temperatures. Engineers should consult the thermal design guide and application notes for guidance on high-temperature operation.
ROHM provides a troubleshooting guide in the application note AN11955, which covers common issues, such as output voltage errors, oscillations, and overheating, and provides guidance on how to identify and resolve these issues.
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BD68620EFV-E2 Overview
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