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BD750L2FP-CE2 - ROHM Semiconductor

Description: Ultra Low Quiescent Current LDO Regulator: The BD7xxL2EFJ/FP-C Series are low quiescent regulators featuring 50V absolute maximum voltage, and output voltage accuracy of ±2%, 200mA output current and 6µA (Typ.) current consumption. There regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. Ceramic capacitors can be used for compensation of the output capacitor phase.

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PCB Footprints
BD750L2FP-CE2 - ROHM Semiconductor PCB footprint - Other - Other - TO252-3 (Dry pack)
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BD750L2FP-CE2 - ROHM Semiconductor  - 3D model - Other - TO252-3 (Dry pack)
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BD750L2FP-CE2 Details

  • Manufacturer Part Number:

    BD750L2FP-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.7 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    50 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    5.8 V

  • JESD-30 Code:

    R-PSSO-G3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.02%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    150 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2%

  • Width:

    5.5 mm

BD750L2FP-CE2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • To ensure stable operation with a high-ESR output capacitor, add a 1-10nF ceramic capacitor in parallel with the output capacitor to reduce the ESR and improve stability.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • Yes, the BD750L2FP-CE2 is rated for operation up to 125°C. However, the maximum operating temperature may be limited by the specific application and PCB design.
  • The power dissipation of the device can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet or by measuring the input and output currents and voltages.

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