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BD7561G-TR - ROHM Semiconductor

Description: ROHM BD7561G-TR Op Amp, 1MHz CMOS, 9 V, 12 V, 5-Pin SSOP

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Symbol
BD7561G-TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
BD7561G-TR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SSOP5
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3D Models
BD7561G-TR - ROHM Semiconductor - 3D model - SOT23 (5-Pin) - SSOP5
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BD7561G-TR Details

  • Manufacturer Part Number:

    BD7561G-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    15.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    1.6 mm

BD7561G-TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is the same as the maximum rating for the VCC pin. Applying a voltage higher than 6V on the EN pin may damage the IC.
  • The BD7561G-TR is rated for operation up to 125°C, but ROHM recommends derating the output current and voltage to ensure reliable operation. Consult the datasheet for derating curves and guidelines for high-temperature operation.
  • The power dissipation of the BD7561G-TR can be calculated using the formula: Pd = (Vin x Iin) + (Vout x Iout) + (Vcc x Icc). ROHM provides a power dissipation calculation tool on their website to simplify the calculation process.

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BD7561G-TR Overview

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