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BD7562F-E2 - ROHM Semiconductor

Description: High Speed Input-Output Full Swing Operational Amplifier

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BD7562F-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP8 (1)
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BD7562F-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP8 (1)
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BD7562F-E2 Details

  • Manufacturer Part Number:

    BD7562F-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Qualification Status:

    Not Qualified

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    15.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    3160

  • Width:

    4.4 mm

BD7562F-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed 6V to prevent damage to the IC.
  • The BD7562F-E2 is rated for operation up to 105°C, but ROHM recommends derating the output current and voltage to ensure reliable operation. It's essential to consult the datasheet and application notes for specific guidance on high-temperature operation.
  • To troubleshoot oscillation or instability issues, ROHM recommends checking the PCB layout for parasitic inductance and capacitance, ensuring that the output capacitor is properly selected and placed, and verifying that the input voltage is within the recommended range. Additionally, reducing the output current or adding a small capacitor in parallel with the output capacitor may help stabilize the operation.

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BD7562F-E2 Overview

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