ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
The BD7562SF-E2 is rated for operation up to 105°C, but ROHM recommends derating the output current and power dissipation to ensure reliable operation. Consult the datasheet for specific derating guidelines and thermal management recommendations.
To calculate the power dissipation of the BD7562SF-E2, use the following formula: Pd = (VIN x IIN) + (VOUT x IOUT) + (VIN x IQ), where IQ is the quiescent current. Consult the datasheet for the specific values of IQ and other parameters.
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