BD7690FJ-E2 - ROHM Semiconductor

BD7690FJ-E2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A 4-layer PCB with a solid ground plane is also recommended to reduce thermal resistance.
• How do I ensure stable operation with a high-impedance input source?
  To ensure stable operation with a high-impedance input source, add a capacitor (e.g., 10nF to 100nF) between the input pin and GND to reduce noise and oscillation. Additionally, consider adding a series resistor (e.g., 1kΩ to 10kΩ) to limit the input current.
• What is the maximum allowed voltage on the EN pin?
  Although the datasheet doesn't specify a maximum voltage for the EN pin, it's recommended to limit the voltage to VCC + 0.3V to prevent damage to the internal ESD protection diodes.
• Can I use the BD7690FJ-E2 in a high-temperature environment?
  While the BD7690FJ-E2 is rated for operation up to 125°C, it's essential to consider the derating of the maximum power dissipation and the reduction of the output current capability at high temperatures. Consult ROHM's application notes for more information.
• How do I prevent latch-up during power-on and power-off transitions?
  To prevent latch-up, ensure that the power supply voltage (VCC) rises and falls slowly (e.g., 10ms to 100ms) and that the input voltage (VIN) is within the specified range during power-on and power-off transitions.